Display device

ABSTRACT

A receiving container for a display device includes a bottom plate, a sidewall and a grounding unit. The sidewall is extended from the bottom plate to define a receiving space. The grounding unit is integrally formed with the bottom plate. The grounding unit includes a grounding member that grounds a circuit board received in the receiving space. The circuit board includes a grounding electrode and the grounding member corresponds to the grounding electrode. The grounding member is formed on a rear surface of the bottom plate. The grounding member may include a protrusion or a projected portion having an elastic structure.

CROSS REFERENCE TO RELATED APPLICATIONS

This application a continuation application of U.S. application Ser. No.12/578,947 filed Oct. 14, 2009, which is a divisional application ofU.S. application Ser. No. 11/265,387 filed Nov. 2, 2005 and issued asU.S. Pat. No. 7,630,023 on Dec. 8, 2009, which claims priority to KoreanPatent Application No. 10-2004-0096269 filed on Nov. 23, 2004 and KoreanPatent Application No. 10-2005-0027162 filed on Mar. 31, 2005, and allthe benefits accruing therefrom under 35 U.S.C. §119, the contents ofwhich are herein incorporated by reference in their entireties.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a receiving container for a display device anda liquid crystal display device having the receiving container. Moreparticularly, the invention relates to a receiving container for adisplay device capable of improving grounding characteristics and aliquid crystal display device having the receiving container.

2. Description of the Related Art

Generally, a liquid crystal display (LCD) device displays images usingelectrical and optical characteristics of liquid crystal installedtherein. The LCD device has various advantages, for example, such asthin thickness, small volume and lightweight in comparison with acathode ray tube (CRT). Thus, LCD devices have been widely used forportable computers, communication devices, television sets, and thelike.

The LCD device includes a liquid crystal controlling unit that controlsthe liquid crystal, and a light providing unit that provides the liquidcrystal with light. For example, the LCD device includes an LCD panelserving as the liquid crystal controlling unit and a backlight assemblyserving as the light providing unit.

The LCD device further includes a driving unit that drives the LCDpanel. The driving unit includes a flexible printed circuit (FPC). TheFPC of the LCD device is grounded in order to protect driving circuitsinstalled thereon from electro-static discharge (ESD) andelectro-magnetic interference (EMI) generated in the LCD device.

The LCD device employs a conductive double-sided adhesive tape to groundthe FPC through a bottom chassis receiving the backlight assembly. Indetail, an insulation layer is formed between the FPC and the bottomchassis, and then the insulation layer is partially removed, so that theremoved insulation layer is replaced with the conductive double-sidedadhesive tape. Thus, the FPC and the bottom chassis are electricallyconnected to each other, so that the FPC is grounded.

Alternatively, a gap is formed between the bottom chassis receiving thebacklight assembly and the FPC. The above-mentioned conductivedouble-sided adhesive tape is replaced with the gap. Thus, although thebottom chassis and the FPC do not make contact with each other, a sparkis induced from a high voltage difference therebetween to generate agrounding path, so that the FPC is grounded.

However, a grounding method using the conductive double-sided adhesivetape has disadvantages in that manufacturing cost of the LCD deviceincreases and manufacturing processes are complex. A grounding methodusing the gap has further disadvantages in that an FPC is irregular andunstable.

SUMMARY OF THE INVENTION

The invention provides a receiving container for a display devicecapable of improving grounding characteristics of a circuit board.

The invention also provides a display device capable of improvinggrounding characteristics of a circuit board.

The invention also provides an LCD device capable of improving groundingcharacteristics of a circuit board.

In an exemplary embodiment, a receiving container for a display deviceincludes a bottom plate, a sidewall and a grounding unit. The sidewallis extended from the bottom plate to define a receiving space. Thegrounding unit is integrally formed with the bottom plate.

In another exemplary embodiment, a display device includes a displaypanel, a circuit board and a receiving container. The display paneldisplays an image. The circuit board provides the display panel with adriving signal. The receiving container receives the display panel. Thereceiving container includes a bottom plate, sidewalls extended from thebottom plate to define a receiving space and a grounding unit integrallyformed with the bottom plate.

In another exemplary embodiment, a display device includes a displaypanel, a receiving container and a circuit board. The display paneldisplays an image. The receiving container receives the display panel.The receiving container includes a bottom plate and sidewalls extendedfrom the bottom plate to define a receiving space. The circuit boardprovides the display panel with a driving signal. The circuit boardincludes a base substrate and a grounding member integrally formed withthe base substrate. The grounding member is protruded from the basesubstrate to make contact with the bottom plate.

In another exemplary embodiment, an LCD device includes a backlightassembly, an LCD panel, an FPC and a receiving container. The backlightunit provides light. The LCD panel displays an image using the light.The FPC provides the LCD panel with a driving signal. The receivingcontainer receives the LCD panel. The receiving container includes abottom plate, sidewalls extended from the bottom plate to define areceiving space and a grounding unit integrally formed with the bottomplate.

In another exemplary embodiment, an LCD device includes a backlightassembly, an LCD panel, a receiving container and a circuit board. Thebacklight unit provides light. The LCD panel displays an image using thelight. The receiving container receives the LCD panel. The receivingcontainer includes a bottom plate and sidewalls extended from the bottomplate to define a receiving space. The circuit board provides the LCDpanel with a driving signal. The circuit board includes a base substrateand a grounding member integrally formed with the base substrate. Thegrounding member is protruded from the base substrate to make contactwith the bottom plate.

Advantageously, manufacturing cost of the LCD device may be reduced anda grounding structure may be simplified. The FPC of the LCD device maybe regularly and stably grounded, such that grounding characteristicsmay be improved. An ESD and an EMI generated from an FPC may be rapidlyremoved through the grounding structure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present invention will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1 is an exploded perspective view illustrating an exemplaryembodiment of an LCD device according to the present invention;

FIG. 2 is an upside-down perspective view illustrating the LCD device inFIG. 1;

FIG. 3 is an exploded perspective view illustrating an exemplaryembodiment of an FPC and a receiving container in FIG. 2;

FIG. 4 is a cross-sectional view taken along line I-I′ in FIG. 3;

FIG. 5 is a cross-sectional view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the present invention;

FIG. 6 is an exploded perspective view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the present invention;

FIGS. 7A and 7B are cross-sectional views taken along line II-II′ inFIG. 6;

FIG. 8 is an exploded perspective view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the present invention;

FIG. 9 is a cross-sectional view taken along line III-III′ in FIG. 8;

FIG. 10 is a cross-sectional view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the present invention;

FIGS. 11A and 11B are cross-sectional views illustrating anotherexemplary embodiment of an FPC and a receiving container of an LCDdevice according to the present invention; and

FIGS. 12A and 12B are cross-sectional views illustrating anotherexemplary embodiment of an FPC and a receiving container of an LCDdevice according to the present invention.

DESCRIPTION OF THE INVENTION

Exemplary embodiments will be described more fully hereinafter withreference to the accompanying drawings, in which embodiments of theinvention are shown. The invention may, however, be embodied in manydifferent forms and should not be construed as limited to theembodiments set forth herein; rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the invention to those skilled in the art. Likereference numerals refer to similar or identical elements throughout.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, the element orlayer can be directly on or connected to another element or layer orintervening elements or layers. In contrast, when an element is referredto as being “directly on” or “directly connected to” another element orlayer, there are no intervening elements or layers present.

It will be understood that, although the terms first, second, third,etc., may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the illustrated embodiments. Spatially relativeterms, such as “lower”, “upper”, “rear” and the like, may be used hereinfor ease of description to describe the relationship of one element orfeature to another element(s) or feature(s) as illustrated in thefigures. It will be understood that the spatially relative terms areintended to encompass different orientations of the device in use oroperation, in addition to the orientation depicted in the figures. Forexample, if the device in the figures is turned over, elements describedas “lower” other elements or features would then be oriented “above”other elements or features. Thus, the exemplary term “lower” canencompass both an orientation of above and below. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing.

FIG. 1 is an exploded perspective view illustrating an exemplaryembodiment of an LCD device according to the invention. FIG. 2 is anupside-down perspective view illustrating the LCD device in FIG. 1.

Referring to FIG. 1, an LCD device 1000 includes a backlight unit 100, adisplay unit 200, a receiving container 300 and a chassis 400.

The backlight unit 100 generates light to provide the display unit 200with the light. The backlight unit 100 includes a light-generating part110, a light guiding plate 120, an optical member 130 and a mold frame140.

The light-generating part 110 includes a plurality of light emittingdiodes (LEDs) 112 and a printed circuit board (PCB) 114. The PCB 114 isdisposed on the LEDs 112 and configured to apply a voltage forgenerating the light to the LEDs 112.

The light guiding plate 120 guides light generated from thelight-generating part 110 toward the optical member 130. The lightguiding plate 120 converts light generated from the LEDs 112 having apoint type distribution into light that has a surface type distribution.

In exemplary embodiments, the light guiding plate 120 may have asubstantially flat plate shape such that the light guiding plate 120 hasa uniform thickness. A thickness of the light guiding plate 120 issubstantially identical from one end portion thereof adjacent to theLEDs 112 to another end portion thereof substantially opposite to theone end portion.

In alternative embodiments, the light guiding plate 120 may have a wedgeshape. A thickness of the light guiding plate 120 may graduallydecreased from one end portion thereof to another end portionsubstantially opposite to the one end portion thereof.

The light emitted from the light guiding plate 120 has somewhat lowluminance uniformity. When the backlight unit 100 includes the lightguiding plate 120, the backlight unit 100 may not provide sufficientlight for displaying an image of high quality. To address thisdisadvantage, the backlight unit 100 may include the optical member 130.The optical member may include, but is not limited to, a light-diffusingsheet, a prism sheet and a dual brightness enhancement film (DBEF).Advantageously, the light-diffusing sheet may enhance the luminanceuniformity of the light emitted from the light guiding plate 120, andthe prism sheet may improve a viewing angle of displayed images. Inaddition, the DBEF may increase the luminance and a viewing angle of thedisplayed images.

Referring to FIG. 1, the mold frame 140 may have a substantially frameshape. The mold frame 140 receives and supports the optical member 130disposed thereon. The mold frame 140 also receives and supports thelight guiding plate 120 placed in a lower portion thereof. The PCB 114is disposed on a side portion of the mold frame 140. The LEDs 112 aredisposed in a plurality of grooves formed at the side portion of themold frame 140.

In exemplary embodiments, the back light unit 100 may include alight-reflecting sheet (not shown). The light-reflecting sheet isdisposed under the light guiding plate 120. The light-reflecting sheetreflects light leaked from the light guiding plate 120 toward the lightguiding plate 120.

Referring again to FIG. 1, the display unit 200 displays images usinglight generated from the backlight unit 100. The display unit 200includes a LCD panel 210, a driver chip 220 and an FPC 230.

The LCD panel 210 includes a thin film transistor (TFT) substrate 212, acolor filter substrate 214 and a liquid crystal layer (not shown)interposed between the TFT substrate 212 and the color filter substrate214.

The TFT substrate 212 may include a pixel electrode (not shown) arrangedin a matrix shape, a TFT (not shown) applying a driving voltage to thepixel electrode, a gate line (not shown) and a data line (not shown).

The color filter substrate 214 may include a color filter (not shown)facing the pixel electrode formed on the TFT substrate 212 and a commonelectrode (not shown) formed on the color filter.

The FPC 230 provides a driving signal for driving the LCD panel 210. Thedriver chip 220 is disposed on the TFT substrate 212 to control timingfor applying the driving signal provided from the FPC 230 to the LCDpanel 210. For example, the driver chip 220 may include chip on glass(COG), whereby the driver chip 220 may be directly formed on the LCDpanel 210.

Referring to FIG. 2, the FPC 230 is flexible, such that the FPC is benttoward a rear surface of the receiving container 300 to be installedthereon. The first, second and third directions shown in FIGS. 1 and 2indicate a direction substantially parallel with a major axis of the LCDpanel 210, a direction substantially parallel with a minor axis of theLCD panel 210, and a light-advancing direction from the backlight unit100 to the LCD panel 210, respectively.

Now referring to FIG. 1, the receiving container 300 receives thebacklight unit 100 and the display unit 200, successively. The receivingcontainer 300 includes a bottom plate 310 and a plurality of sidewalls320. The sidewalls 320 may be integrally formed with the bottom plate310 and extend in the third direction from the bottom plate 310 todefine a receiving space. A grounding member 330 is integrally formedwith a rear surface of the bottom plate 310 of the receiving container300 to ground the FPC 230 to the receiving container 300.

The chassis 400 surrounds an edge portion of the LCD panel 210. Thechassis 400 is combined with the receiving container 300. The chassis400 essentially protects the LCD panel 210, and prevents shifting of theLCD panel 210.

Hereinafter, a grounding structure of the FPC 230 will be described morefully with reference to the accompanying drawings. In the illustratedembodiment, the grounding structure of the FPC 230 that drives the LCDpanel 210 will be described. However, in alternative embodiments,various circuit boards of the LCD device 1000 may employ the groundingstructure.

FIG. 3 is an exploded perspective view illustrating an exemplaryembodiment of an FPC and a receiving container in FIG. 2. FIG. 4 is across-sectional view taken along line I-I′ in FIG. 3.

Referring to FIGS. 3 and 4, the FPC 230 is placed on the rear surface ofthe receiving container 300. The FPC 230 is flexible, so that the FPC230 may be bent toward the rear surface of the receiving container 300to be installed thereon.

The FPC 230 includes a base substrate 232 and at least one groundingelectrode 234 formed on the base substrate 232. In the illustratedembodiment, the FPC 230 has three grounding electrodes 234. Inalternative embodiments, a number of the grounding electrodes 234 may bemore or less than three. For example, the FPC 230 may have one groundingelectrode 234 disposed substantially in the second direction of the FPC230.

The grounding electrode 234 makes contact with the grounding member 330protruded from the bottom plate 310 of the receiving container 300. Thegrounding member 330 corresponds to the grounding electrode 234. In theillustrated embodiment, the grounding member 330 has a substantiallyrectangular plate shape. A stepped portion is formed between the bottomplate 310 and the grounding member 330. The grounding member 330 makescontact with the grounding electrode 234.

The FPC 230 further includes an insulation layer 236 electricallyinsulating the FPC 230 from the receiving container 300. The insulationlayer 236 is formed on the base substrate 232 to prevent various circuitpatterns formed on the base substrate 232 from being electricallyconnected to the bottom plate 310 of the receiving container 300. Anopening corresponding to the grounding member 330 is formed through theinsulation layer 236. A portion of the insulation layer 236 at which thegrounding electrode 234 is placed is open, such that the groundingelectrode 234 and the grounding member 330 corresponding thereto may beelectrically connected to each other. For example, the opening of theinsulation layer 236 may be formed on the FPC 230 corresponding to aperipheral portion of the bottom plate 310, and the grounding member 330is placed at the peripheral portion of the bottom plate 310. Inalternative embodiments, various positions of the opening and thegrounding member 330 are contemplated.

The insulation layer 236 is combined with the base substrate 232 of theFPC 230 through a first adhesive member 236 a, and combined with thebottom plate 310 of the receiving container 300 through a secondadhesive member 236 b. The first and second adhesive members 236 a and236 b may include a gluing agent or a double-sided adhesive tape. Inexemplary embodiments, the first and second adhesive members 236 a and236 b may be the same or different types of material. For example, inthe illustrated embodiment, the first and second adhesive members 236 aand 236 b of FIG. 4 are a gluing agent and a double-sided adhesive tape,respectively.

In another exemplary embodiment, the grounding member 330 and thereceiving container 300 may include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 through the groundingmember 330.

In alternative embodiments, the grounding member 330 may include aconductive elastic material such as conductive rubber, such that thegrounding member 330 may make contact with the grounding electrode 234more firmly.

FIG. 5 is a cross-sectional view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the invention. The LCD device the illustrated embodiment issubstantially identical to the LCD device of FIGS. 1-4 except for agrounding member. Thus, any further description for the substantiallysame elements will be omitted.

Referring to FIG. 5, a grounding member 332 includes at least oneprotrusion 332 a. In the illustrated embodiment, a plurality ofprotrusions 332 a is protruded from the bottom plate 310 of thereceiving container 300. The protrusions 332 a are protruded toward theFPC 230 to make contact with the grounding electrode 234 formed on theFPC 230.

The grounding member 332 corresponds to the grounding electrode 234, andthe protrusions 332 a make contact with the grounding electrode 234. Forexample, the grounding member 332 is placed at a peripheral portion ofthe bottom plate 310. In alternative embodiments, various positions ofthe grounding member 332 are contemplated.

In exemplary embodiments, the grounding member 332 and the receivingcontainer 300 may include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 through the groundingmember 332.

In alternative embodiments, the grounding member 332 may include aconductive elastic material such as conductive rubber, such that thegrounding member 332 may make contact with the grounding electrode 234more firmly.

FIG. 6 is an exploded perspective view illustrating an exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the invention. FIGS. 7A and 7B are cross-sectional viewstaken along line II-II′ in FIG. 6. FIGS. 7A and 7B illustrate the FPCand the receiving container of the LCD device before and after the FPCis disposed on the receiving container, respectively. The LCD device ofthe illustrated embodiment is substantially identical to the LCD deviceof FIGS. 1-4 except for a grounding member. Thus, any furtherdescription for the substantially same elements will be omitted.

Referring to FIGS. 6 and 7B, the FPC 230 has three grounding electrodes234 in the illustrated embodiment. In alternative embodiments, a numberof the grounding electrodes 234 may be more or less than three. Forexample, the grounding electrode 234 may have one grounding electrode234 extended substantially toward the second direction. The groundingelectrode 234 makes contact with a grounding member 334 protruded fromthe bottom plate 310 of the receiving container 300. The groundingmember 334 corresponds to the grounding electrode 234.

In the illustrated embodiment, one end portion of the grounding member334 makes contact with the bottom plate 310, and another end portion ofthe grounding member 334 is spaced apart from the bottom plate 310. Theend portion spaced apart from the bottom plate 310may include a contactportion having a substantially rectangular plate shape to make contactwith the grounding electrode 234, as shown in FIG. 6. In the illustratedembodiment, the grounding member 334 may be disposed on a peripheralportion of the bottom plate 310 of the receiving container 300. However,various positions of the grounding member 334 are also contemplated.

Referring to FIGS. 7A and 7B, the grounding member 334 corresponds to aprojected portion formed on the bottom plate 310 of the receivingcontainer 300. The grounding member 334 includes an extension portionextended toward the FPC 230 and a contact portion making contact withthe grounding electrode 234. The extension portion is extended obliquelytoward the FPC 230, and the contact portion is extended substantiallyparallel with the FPC 230.

Before the FPC 230 is placed on the bottom plate 310 of the receivingcontainer 300, the grounding member 334 has a first height larger than asecond height corresponding to a total thickness of the first adhesivemember 236 a, the insulation layer 236 and the second adhesive member236 b. However, after the FPC 230 is placed on the bottom plate 310 ofthe receiving container 300, the grounding member 334 has a third heightsubstantially same as the second height. In exemplary embodiments, thegrounding member 334 essentially supports the FPC 230 because thegrounding member 334 may have an elastic structure. Advantageously, thegrounding member 334 may make contact with the grounding electrode 234more firmly.

In the illustrated embodiment, the grounding member 334 is extended froma central portion toward a peripheral portion of a rear surface of thebottom plate 310 as shown in FIGS. 6 to 7B. Alternatively, the groundingmember 334 may be extended from the peripheral portion toward thecentral portion of the rear surface of the bottom plate 310.

In exemplary embodiments, the grounding member 334 and the receivingcontainer 300 may include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 through the groundingmember 334.

In alternative embodiments, the grounding member 334 may include aconductive elastic material such as conductive rubber, such that thegrounding member 334 may make contact with the grounding electrode 234more firmly.

FIG. 8 is an exploded perspective view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the invention. FIG. 9 is a cross-sectional view taken alongline III-III′ in FIG. 8. The LCD device of the illustrated embodiment issubstantially identical to the LCD device of FIGS. 6, 7A and 7B exceptfor an insulation layer and a receiving container. Thus, any furtherdescription for the substantially same elements will be omitted.

Referring to FIGS. 8 and 9, a receiving container 300 a includes abottom plate 310 a and a plurality of sidewalls 320 a. The sidewalls 320a may be integrally formed with the bottom plate 310 a and extend in thethird direction from the bottom plate 310 a to define a receiving space.The insulation layer 236 is formed on the base substrate 232 to preventvarious circuit patterns formed on the base substrate 232 from beingelectrically connected to the bottom plate 310 a of the receivingcontainer 300 a. In exemplary embodiments, an opening corresponding to agrounding member 334 a may be formed through the insulation layer 236. Aportion of the insulation layer 236 at which the grounding electrode 234is placed is open, such that the grounding electrode 234 and thegrounding member 334 a corresponding thereto may be electricallyconnected to each other. In alternative embodiments, the opening of theinsulation layer 236 may be formed on the FPC 230 adjacent to a bentportion thereof. The grounding member 334 a is placed at an end portionof the bottom plate 310 a proximate the bent portion of the FPC 230, asshown in FIGS. 9 and 10. Advantageously, an opening process of theinsulation layer 236 is not required, such that a manufacturing processof an LCD device 1000 may be simplified.

The insulation layer 236 is combined with the base substrate 232 of theFPC 230 through the first adhesive member 236 a, and combined with thebottom plate 310 a of the receiving container 300 a through the secondadhesive member 236 b. The first and second adhesive members 236 a and236 b may include a gluing agent or a double-sided adhesive tape. Inexemplary embodiments, the first and second adhesive members 236 a and236 b may be the same or different types of material. For example, inthe illustrated embodiment, the first and second adhesive members 236 aand 236 b of FIG. 9 are a gluing agent and a double-sided adhesive tape,respectively.

In the illustrated embodiment, the grounding member 334 a is extendedfrom a central portion toward a peripheral portion of a rear surface ofthe bottom plate 310 a as shown in FIG. 9. Alternatively, the groundingmember 334 a may be extended from the peripheral portion toward thecentral portion of the rear surface of the bottom plate 310 a.

In exemplary embodiments, the grounding member 334 a and the receivingcontainer 300 a include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 a through the groundingmember 334 a.

In alternative embodiments, the grounding member 334 a may include aconductive elastic material such as conductive rubber, such that thegrounding member 334 a may make contact with the grounding electrode 234more firmly.

FIG. 10 is a cross-sectional view illustrating another exemplaryembodiment of an FPC and a receiving container of an LCD deviceaccording to the invention. The LCD device of the illustrated embodimentis substantially identical to the LCD device of FIGS. 8 and 9 except fora receiving container and a grounding member. Thus, any furtherdescription for the substantially same elements will be omitted.

Referring to FIG. 10, a grounding member 334 b is extended from an endportion of a bottom plate 310 b of a receiving container 300 b, andintegrally formed with the bottom plate 310 b, such that the groundingmember 334 b constitutes a part of the receiving container 300 b.Advantageously, a forming process of a separate grounding member 334 bmay be omitted, such that a manufacturing process of an LCD device maybe simplified.

The receiving container 300 b may have a pair of sidewalls (not shown)protruded from the bottom plate 310 b, and the grounding member 334 b isformed at an end portion of the bottom plate 310 b between thesidewalls. The receiving container 300 b may not include a sidewallcorresponding to a bent portion of the FPC 230. The grounding member 334b may be extended substantially in a third direction shown in FIG. 10 toform a sidewall of the receiving container 300 b. In alternativeembodiments, the receiving container 300 b may include more than twosidewalls.

In exemplary embodiments, the grounding member 334 b and the receivingcontainer 300 b include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 b through the groundingmember 334 b.

In alternative embodiments, the grounding member 334 b may include aconductive elastic material such as conductive rubber, so that thegrounding member 334 b may make contact with the grounding electrode 234more firmly.

FIGS. 11A and 11B are cross-sectional views illustrating anotherexemplary embodiment of an FPC and a receiving container of an LCDdevice according to the invention. FIGS. 11A and 11B illustrate the FPCand the receiving container of the LCD device before and after the FPCis disposed on the receiving container, respectively. The LCD device ofthe illustrated embodiment is substantially identical to the LCD deviceof FIGS. 1-4 except for a grounding member. Thus, any furtherdescription for the substantially same elements will be omitted.

Referring to FIGS. 11A and 11B, a grounding member 336 a is integrallyformed with the base substrate 232, and protruded from the basesubstrate 232 to make contact with the bottom plate 310 of the receivingcontainer 300. The grounding member 336 a is electrically connected tothe grounding electrode 234. In the illustrated embodiment, thegrounding member 336 a has a rectangular plate shape, and a steppedportion is formed between the base substrate 232 of the FPC 230 and thegrounding member 336 a. The grounding member 336 a makes contact withthe bottom plate 310 of the receiving container 300.

The FPC 230 further includes an insulation layer 236 electricallyinsulating the FPC 230 from the receiving container 300. The insulationlayer 236 is formed on the base substrate 232 to prevent various circuitpatterns formed on the base substrate 232 from being electricallyconnected to the bottom plate 310 of the receiving container 300. Anopening is formed through the insulation layer 236 such that thegrounding member 336 a is disposed thereat. A portion of the insulationlayer 236 at which the grounding electrode 234 is placed is open, sothat the grounding electrode 234 and the receiving container 300 may beelectrically connected to each other through the grounding member 336 a.

The opening of the insulation layer 236 is formed on the FPC 230corresponding to a peripheral portion of the bottom plate 310, and thegrounding member 336 a is placed at the opening. However, variouspositions of the opening and the grounding member 336 a arecontemplated.

The insulation layer 236 is combined with the base substrate 232 of theFPC 230 through the first adhesive member 236 a, and combined with thebottom plate 310 of the receiving container 300 through the secondadhesive member 236 b. The first and second adhesive members 236 a and236 b may include a gluing agent or a double-sided adhesive tape. Inexemplary embodiments, the first and second adhesive members 236 a and236 b may be the same or different types of material. For example, inthe illustrated embodiment, the first and second adhesive members 236 aand 236 b of FIGS. 11A and 11B are a gluing agent and a double-sidedadhesive tape, respectively.

In exemplary embodiments the grounding member 336 a and the receivingcontainer 300 include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 through the groundingmember 336 a.

In alternative embodiments, the grounding member 336 a may include aconductive elastic material such as conductive rubber, such that thegrounding member 336 a may make contact with the grounding electrode 234more firmly.

A grounding structure of the FPC 230 according to the illustratedembodiment is employed for electrically connecting the FPC 230 to thereceiving container 300. The grounding structure of the FPC 230 may alsobe employed for electrically connecting an FPC 230 to another FPC 230.Alternatively, the grounding structure of the FPC 230 may be employedfor electrically connecting an FPC 230 to a PCB.

FIGS. 12A and 12B are cross-sectional views illustrating anotherexemplary embodiment of an FPC and a receiving container of an LCDdevice according to the invention. FIGS. 12A and 12B illustrate the FPCand the receiving container of the LCD device before and after the FPCis disposed on the receiving container, respectively. The LCD device ofthe illustrated embodiment is substantially identical to the LCD deviceof FIGS. 11A and 11B 6 except for a grounding member. Thus, any furtherdescription for the substantially same elements will be omitted.

Referring to FIGS. 12A and 12B, the insulation layer 236 is formed onthe base substrate 232 to prevent various circuit patterns formed on thebase substrate 232 from being electrically connected to a bottom plate310 of a receiving container 300. An opening is formed through theinsulation layer 236 such that a grounding member 336 b may be disposedthereat. A portion of the insulation layer 236 at which the groundingelectrode 234 is placed is open, such that the grounding electrode 234and the receiving container 300 may be electrically connected to eachother through the grounding member 336 b.

In exemplary embodiments, the opening of the insulation layer 236 isformed on an end portion of the FPC 230, and the grounding member 336 bis placed at an end portion of the base substrate 232. Advantageously,an opening process of the insulation layer 236 is not required, suchthat a manufacturing process of an LCD device may be simplified.

The insulation layer 236 is combined with the base substrate 232 of theFPC 230 through the first adhesive member 236 a, and combined with thebottom plate 310 of the receiving container 300 through the secondadhesive member 236 b. The first and second adhesive members 236 a and236 b may include a gluing agent or a double-sided adhesive tape. Inexemplary embodiments, the first and second adhesive members 236 a and236 b may be the same or different types of material. For example, inthe illustrated embodiment, the first and second adhesive members 236 aand 236 b of FIGS. 12A and 12B are a gluing agent and a double-sidedadhesive tape, respectively.

In exemplary embodiments, the grounding member 336 b and the receivingcontainer 300 may include a conductive material such as metal.Advantageously, an ESD and an EMI generated from the FPC 230 may berapidly removed to the receiving container 300 through the groundingmember 336 b.

In alternative embodiments, the grounding member 336 b may include aconductive elastic material such as conductive rubber, so that thegrounding member 336 b may make contact with the grounding electrode 234more firmly.

A grounding structure of the FPC 230 as illustrated in the aboveexemplary embodiment may be employed for electrically connecting the FPC230 to the receiving container 300. The grounding structure of the FPC230 may also be employed for electrically connecting an FPC 230 toanother FPC 230. Alternatively, the grounding structure of the FPC 230may be employed for electrically connecting an FPC 230 to a PCB.

According to the illustrated embodiments, a grounding member isprotruded from a receiving container for a display device to ground anFPC. Alternatively, a grounding member may be protruded from an FPC toground the FPC.

A display device as in the illustrated embodiments may not include agrounding member including conductive double-sided adhesive tape inorder to ground an FPC. Advantageously, manufacturing cost of thedisplay device may be reduced and a grounding structure may besimplified.

As a further advantage, the FPC is regularly and stably grounded, suchthat grounding characteristics thereof may be improved and an ESD and anEMI generated from an FPC may be rapidly removed through the groundingstructure.

Although the exemplary embodiments in the illustrated embodiments havebeen described, it is understood that the invention should not belimited to these exemplary embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the invention as hereinafter claimed.

What is claimed is:
 1. A backlight assembly, comprising: a light sourcegenerating light; a bottom chassis configured to receive the lightsource, the bottom chassis being electrically conductive and comprising:a bottom plate; and a grounding member disposed on the bottom plate, thegrounding member integrally formed with the bottom plate; a circuitboard disposed on the bottom plate; and an insulation layer disposedbetween the circuit board and the bottom plate, wherein the insulationlayer defines an opening exposing the circuit board and a portion of thebottom plate, and the grounding member is protruded through the openingto electrically connect the circuit board to the bottom plate.
 2. Adisplay device comprising: a display panel displaying an image; areceiving container receiving the display panel, the receiving containerincluding a bottom plate, and sidewalls extended from the bottom plateto define a receiving space; and a circuit board providing the displaypanel with a driving signal, the circuit board including a basesubstrate, and a grounding member integrally formed with the basesubstrate, the grounding member being protruded from the base substrateto make contact with the bottom plate.
 3. The display device of claim 2,wherein the base substrate is flexible.
 4. The display device of claim2, wherein the circuit board is disposed on a rear surface of the bottomplate of the receiving container.
 5. The display device of claim 2,wherein the circuit board further includes a grounding electrodedisposed on the base substrate, and the grounding electrode iselectrically connected to the grounding member.
 6. The display device ofclaim 2, wherein the grounding member includes a conductive elasticmaterial.
 7. The display device of claim 2, further comprising aninsulation layer configured to electrically insulate the circuit boardand the receiving container from each other, the insulating layer havingan opening corresponding to the grounding member.
 8. The display deviceof claim 2, wherein the grounding member is disposed on a peripheralportion of the circuit board.
 9. The display device of claim 2, whereinthe grounding member and the bottom plate include a conductive material.10. A liquid crystal display device comprising: a backlight unitproviding light; a liquid crystal display panel displaying an imageusing the light; a receiving container receiving the liquid crystaldisplay panel, the receiving container including a bottom plate, andsidewalls extended from the bottom plate to define a receiving space;and a circuit board providing the liquid crystal display panel with adriving signal, the circuit board including a base substrate, and agrounding member integrally formed with the base substrate, thegrounding member being protruded from the base substrate to make contactwith the bottom plate.